Tengling Semiconductor has advanced reliability testing and failure analysis technology, and conducts rigorous reliability tests on products by simulating various extreme environments. Including constant temperature and humidity after reflow soldering, high temperature and high pressure cooking, cold and hot shock, etc., to ensure that the products meet the MSL3 level. At the same time, we will also use advanced equipment such as push-pull test, multifunctional push-pull test, X-RAY inspection, visual system appearance inspection and C-SCAN inspection to ensure the excellent quality of products in all directions.