Tengling Semiconductor's advanced reliability testing and failure analysis technology makes the products worry-free. Through various extreme environment simulations, the products are subjected to rigorous reliability tests to ensure that the products meet the MSL3 level. At the same time, we will also use advanced equipment such as crystal pushing test, multifunctional push-pull test, X-RAY inspection, visual system appearance inspection and C-SCAN inspection to ensure the stability and reliability of products in practical application.